Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition / aut. Roman Koleňák
Koleňák Roman ; 063700 
Soldering and Surface Mount Technology . Vol. 29, iss. 3 (2017), s. 121-132
shear strength lanthanides ultrasonic soldering
http://www.emeraldinsight.com/doi/full/10.1108/SSMT-08-2016-0018
http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=X1BQdlqFvdCFpZFdEQY&page=1&doc=1
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