Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej Pašák
Koleňák Roman ; 063700  Kostolný Igor ; 063000 Drápala Jaromír Kusý Martin ; 061000 Pašák Matej ; 061000
Soldering and Surface Mount Technology . Vol. 31, iss. 2 (2019), s. 93-101
shear strength phase composition joints interface
https://www.emeraldinsight.com/doi/pdfplus/10.1108/SSMT-10-2018-0039
http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=D21GYHP2oU3zuwrpd4d&page=1&doc=1
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