Number of the records: 1  

Wettability of selected lead-free solders for higher application temperatures

  1. CREPC201606 CREPC201607 CREPC201609 CREPC102016 CREPC201611 CREPC201701 CREPC201702 CREPC201703 C
    Title statementWettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný, Pavol Šebo
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z3 (Author) - MTF Ústav výrobných technológií
    Šebo, Pavol (Author)
    Notečlánok publikovaný v časopise: Key Engineering Materials, ISSN 1662-9795, Vol. 705, 2016, pp. 190-195
    In 2016 IACSIT Hong Kong Conferences / 2016 IACSIT Hong Kong Conferences. -- [b.m.] : IACSIT Press, 2016. -- ISSN 1662-9795. -- CD-ROM, s.[6]
    Subj. Headings solder
    substrate
    wetting
    LanguageEnglish
    URLhttps://www.scopus.com/record/display.uri?eid=2-s2.0-84984602072&origin=resultslist&sort=plf-f&src=s&st1=wettability+of+selected+lead-free+solders+for+higher+application+temperatures&st2=&sid=A4D95E46B7A69AC9AF6AFDC88FD4E44A.N5T5nM1aaTEF8rE6yKCR3A%3a20&sot=b&sdt=b&sl=92&s=TITLE-ABS-KEY%28wettability+of+selected+lead-free+solders+for+higher+application+temperatures%29&relpos=0&citeCnt=0&searchTerm=
    Document kindRZB - článok zo zborníka
    CategoryAFC - Reports at international scientific conferences
    Year2016
    article

    article

Number of the records: 1