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Direct bonding of silicon with solders type Sn-Ag-Ti
CREPC201609 CREPC102016 CREPC201611 CREPC201701 CREPC201702 CREPC201703 CREPC201706 Title statement Direct bonding of silicon with solders type Sn-Ag-Ti / aut. Roman Koleňák, Igor Kostolný, Martin Sahul Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva Another responsib. Kostolný, Igor, 1988- Z3 (Author) - MTF Ústav výrobných technológií Sahul, Martin, 1985- Z2 (Author) - MTF Ústav materiálov In Soldering and Surface Mount Technology. -- ISSN 0954-0911. -- Vol. 28, Iss. 3 (2016), s. 149-158 Subj. Headings shear strength silicon soldering Language English URL http://dx.doi.org/10.1108/SSMT-11-2015-0040 Document kind RBX - článok z periodika Category ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu In databases
SCOPUS: DOI: 10.1108/SSMT-11-2015-0040Year 2016 
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