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Effect of in addition to Zn-5Al solder on microstructure and properties of solder joints

  1. CREPC201709 CREPC201710 CREPC201711 CREPC022018 CREPC201802 CREPC201803 CREPC201806
    Title statementEffect of in addition to Zn-5Al solder on microstructure and properties of solder joints / aut. Igor Kostolný, Roman Koleňák
    Main entry-name Kostolný, Igor, 1988- (Author) - MTF Ústav výrobných technológií
    Another responsib. Koleňák, Roman, 1973- Z1 (Author) - MTF Katedra zvárania a zlievarenstva
    In Key Engineering Materials / International Conference on Material Science and Engineering. -- ISSN 1013-9826. -- Vol. 723: Selected, peer reviewed papers from the International Conference on Material Science and Engineering (ICMSE 2016), June 24-26, 2016, Guangzhou, China, (2017), s. 357-362
    Subj. Headings solder
    flux free soldering
    joints
    LanguageEnglish
    URLhttps://www.scopus.com/record/display.uri?eid=2-s2.0-85009110535&origin=resultslist&sort=plf-f&src=s&st1=Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints&st2=&sid=E230406AC6FFBDD2A1ED32FA12A49A1F.wsnAw8kcdt7IPYLO0V48gA%3a10&sot=b&sdt=b&sl=103&s=TITLE-ABS-KEY%28Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints%29&relpos=0&citeCnt=0&searchTerm=
    Document kindRZB - článok zo zborníka
    CategoryAFC - Reports at international scientific conferences
    Year2017
    References (1) - článok
    rok vydaniarok metrikyIFIF Q (best)SJRSJR Q (best)
    201720170.180Q3
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Number of the records: 1