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Effect of in addition on microstructure and properties of Zn-5Al solder

  1. CREPC201709 CREPC201710 CREPC201711 CREPC022018 CREPC201802 CREPC201803 CREPC201806
    Title statementEffect of in addition on microstructure and properties of Zn-5Al solder / aut. Roman Koleňák, Igor Kostolný
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z3 (Author) - MTF Ústav výrobných technológií
    In Key Engineering Materials / International Conference on Material Science and Engineering Technology. -- ISBN 978-3-0357-1033-5. -- ISSN 1013-9826. -- Vol. 737. Selected, peer reviewed papers from the 2016 International Conference on Material Science and Engineering Technology (ICMSET 2016), October 14-16, 2016, Phuket, Thailand, (2017), s. 107-113
    Subj. Headings solder
    microstructure
    strength
    LanguageEnglish
    Document kindRZB - článok zo zborníka
    CategoryAFC - Reports at international scientific conferences
    Year2017
    rok vydaniarok metrikyIFIF Q (best)SJRSJR Q (best)
    201720170.180Q3
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    article

Number of the records: 1