Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures /

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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

Title statement	Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
Main entry-name	Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
Another responsib.	Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií
In	AIMS Materials Science. -- ISSN 2372-0484. -- Vol. 5, iss. 5 (2018), online, s. 889-901
Subj. Headings	solder
	substrate
	wetting
	thermal properties
Language	English
URL	http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
	https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm=
Document kind	RBX - článok z periodika
Category	ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
In databases
Year	2018

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