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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
Title statement Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií In AIMS Materials Science. -- ISSN 2372-0484. -- Vol. 5, iss. 5 (2018), online, s. 889-901 Subj. Headings solder substrate wetting thermal properties Language English URL http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm= Document kind RBX - článok z periodika Category ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu In databases WOS: 000449298600003
DOI: 10.3934/matersci.2018.5.889
SCOPUS: 2-s2.0-85055565532Year 2018 article
Number of the records: 1