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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

  1. Title statementInvestigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií
    In AIMS Materials Science. -- ISSN 2372-0484. -- Vol. 5, iss. 5 (2018), online, s. 889-901
    Subj. Headings solder
    substrate
    wetting
    thermal properties
    LanguageEnglish
    URLhttp://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
    https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm=
    Document kindRBX - článok z periodika
    CategoryADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    Year2018
    rok vydaniarok metrikyIFIF Q (best)SJRSJR Q (best)
    201820180.320Q3
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Number of the records: 1