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Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg

  1. Title statementResearch on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Marián Drienovský, Martin Sahul
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií
    Drápala, Jaromír (Author)
    Drienovský, Marián, 1983- Z2 (Author) - MTF Ústav materiálov
    Sahul, Martin, 1985- Z2 (Author) - MTF Ústav materiálov
    In Journal of Composite Materials. -- ISSN 0021-9983. -- Vol. 53, iss. 10 (2019), s. 1411-1422
    Subj. Headings ultrasonic soldering
    grain boundary
    shear strength
    LanguageEnglish
    URLhttp://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=18&SID=F1CtxJSNakvf1CaXOOZ&page=1&doc=1
    Document kindRBX - článok z periodika
    CategoryADC - Scientific titles in foreign carented magazines and noticed year-books
    Category (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    In databases CC: 000462777800012
    WOS: 000462777800012
    DOI: 10.1177/0021998319835304
    SCOPUS: 2-s2.0-85062729562
    Year2019
    article

    article

Number of the records: 1  

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