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Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg
Title statement Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Marián Drienovský, Martin Sahul Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií Drápala, Jaromír (Author) Drienovský, Marián, 1983- Z2 (Author) - MTF Ústav materiálov Sahul, Martin, 1985- Z2 (Author) - MTF Ústav materiálov In Journal of Composite Materials. -- ISSN 0021-9983. -- Vol. 53, iss. 10 (2019), s. 1411-1422 Subj. Headings ultrasonic soldering grain boundary shear strength Language English URL http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=18&SID=F1CtxJSNakvf1CaXOOZ&page=1&doc=1 Document kind RBX - článok z periodika Category ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu In databases CC: 000462777800012
WOS: 000462777800012
DOI: 10.1177/0021998319835304
SCOPUS: 2-s2.0-85062729562Year 2019 article
Number of the records: 1