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Direct ultrasonic soldering of AlN ceramics with copper substrate using Zn-Al-Mg solder

Title statement	Direct ultrasonic soldering of AlN ceramics with copper substrate using Zn-Al-Mg solder / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Zacková, Marcel Kuruc
Main entry-name	Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov
Another responsib.	Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
	Drápala, Jaromír (Author)
	Zacková, Paulína, 1988- Z2 (Author) - MTF Ústav materiálov
	Kuruc, Marcel, 1988- Z1 (Author) - MTF Katedra obrábania a počítačovej podpory technológií
Note	1/0303/20
In	Metals. -- ISSN 2075-4701. -- Vol. 10, iss. 2 (2020), s. 1-18
Subj. Headings	ultrasonic soldering
	Zn solder
	active elements
	boundary
	shear strength
Language	English
URL	https://www.mdpi.com/2075-4701/10/2/160
Document kind	RBX - článok z periodika
Category	ADC - Scientific titles in foreign carented magazines and noticed year-books
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
In databases	CC: 000522450800005 WOS: 000522450800005 DOI: 10.3390/met10020160 SCOPUS: 2-s2.0-85078537886
Year	2020

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Number of the records: 1