Number of the records: 1
Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
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$2 DOI $a 10.3934/matersci.2018.5.889 024 7-
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$7 stu_us_auth*stu42582 $a Koleňák, Roman, $d 1973- $u 063700 $4 aut $9 70 $r Z1 $U MTF Ústav výrobných technológií $T MTF Katedra zvárania a zlievarenstva $X 2767 $U M3700 $Y 842 245 10
$a Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / $c aut. Roman Koleňák, Igor Kostolný 650 04
$7 stu_us_auth*stus44261 $a solder 650 04
$7 stu_us_auth*stus44863 $a substrate 650 04
$7 stu_us_auth*stus41140 $a wetting 650 04
$7 stu_us_auth*stus31906 $a thermal properties 700 1-
$7 stu_us_auth*stu95921 $a Kostolný, Igor, $d 1988- $u 063000 $r Z2 $4 aut $9 30 $U MTF Materiálovotechnologická fakulta $T MTF Ústav výrobných technológií $X 48661 $U M3000 $Y 83 773 0-
$w stu_us_cat*0067011 $t AIMS Materials Science $x 2372-0484 $7 nnas $g Vol. 5, iss. 5 (2018), online, s. 889-901 856 4-
$u http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf 856 4-
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Number of the records: 1