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Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

  1. Title statementCharacterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Sahul, Ján Urminský
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií
    Drápala, Jaromír (Author)
    Sahul, Martin, 1985- Z2 (Author) - MTF Ústav materiálov
    Urminský, Ján, 1989- Z3 (Author) - MTF Ústav výrobných technológií
    NoteIF 2017: 1,704
    In Metals. -- ISSN 2075-4701. -- Vol. 8, iss. 4 (2018), s.274-274
    Subj. Headings solder
    ceramics
    Copper
    LanguageEnglish
    URLhttp://www.mdpi.com/2075-4701/8/4/274
    http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=C5gAsJpoWyyGa5AfUVj&page=1&doc=1
    Document kindRBX - článok z periodika
    CategoryADC - Scientific titles in foreign carented magazines and noticed year-books
    Category (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    In databases CC: 000434882800077

    DOI: 10.3390/met8040274
    Year2018
    article

    article

Number of the records: 1  

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