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  1. Application of a ternary ZN-based solder alloy for joining of AZ31B magnesium alloy with ultrasonic support / aut. Miroslav Jáňa, Igor Kostolný
    Jáňa Miroslav  Kostolný Igor ; 063100
    Zváranie - Svařování : . Roč. 68, č. 1 (2019), s. 27-29
    metallurgical joining solder Mg alloys intermetallic phases
    článok z periodika
    BDF - Scientific works in others home magazines
    article

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  2. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Sahul, Ján Urminský
    Koleňák Roman ; 063700  Kostolný Igor ; 063000 Drápala Jaromír Sahul Martin ; 061000 Urminský Ján ; 063000
    Metals . Vol. 8, iss. 4 (2018), s.274-274
    solder ceramics Copper
    http://www.mdpi.com/2075-4701/8/4/274
    http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=C5gAsJpoWyyGa5AfUVj&page=1&doc=1
    článok z periodika
    ADC - Scientific titles in foreign carented magazines and noticed year-books
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  3. Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
    Koleňák Roman ; 063700  Kostolný Igor ; 063000
    AIMS Materials Science : . Vol. 5, iss. 5 (2018), online, s. 889-901
    solder substrate wetting thermal properties
    http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
    https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm=
    článok z periodika
    ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    article

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  4. Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound / aut. Roman Koleňák
    Koleňák Roman ; 063700 
    Recent Progress in Soldering Materials . online, s. 63-90
    solder active solder metallic materials
    https://www.intechopen.com/books/recent-progress-in-soldering-materials/recent-advances-in-solderability-of-ceramic-and-metallic-materials-with-application-of-active-solder
    kapitola(článok) z dokumentu
    AEC - Scientific titles in foreign noticed scientific year-books (not conference)
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  5. Effect of in addition to Zn-5Al solder on microstructure and properties of solder joints / aut. Igor Kostolný, Roman Koleňák
    Kostolný Igor ; 063000  Koleňák Roman ; 063700
    Key Engineering Materials . Vol. 723: Selected, peer reviewed papers from the International Conference on Material Science and Engineering (ICMSE 2016), June 24-26, 2016, Guangzhou, China, (2017), s. 357-362
    solder flux free soldering joints
    https://www.scopus.com/record/display.uri?eid=2-s2.0-85009110535&origin=resultslist&sort=plf-f&src=s&st1=Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints&st2=&sid=E230406AC6FFBDD2A1ED32FA12A49A1F.wsnAw8kcdt7IPYLO0V48gA%3a10&sot=b&sdt=b&sl=103&s=TITLE-ABS-KEY%28Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints%29&relpos=0&citeCnt=0&searchTerm=
    článok zo zborníka
    AFC - Reports at international scientific conferences
    (1) - článok
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  6. Effect of in addition on microstructure and properties of Zn-5Al solder / aut. Roman Koleňák, Igor Kostolný
    Koleňák Roman ; 063700  Kostolný Igor ; 063000
    Key Engineering Materials . Vol. 737. Selected, peer reviewed papers from the 2016 International Conference on Material Science and Engineering Technology (ICMSET 2016), October 14-16, 2016, Phuket, Thailand, (2017), s. 107-113
    solder microstructure strength
    článok zo zborníka
    AFC - Reports at international scientific conferences
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  7. Application of a ternary Zn-based solder alloy for joining of AZ31B magnesium alloy with ultrasonic support / aut. Miroslav Jáňa, Milan Turňa, Milan Marônek, Marcel Kuruc, Pavel Bílek
    Jáňa Miroslav ; M3000  Turňa Milan ; M3000 Marônek Milan ; M3000 Kuruc Marcel ; M3000 Bílek Pavel ; M1000
    Advanced Materials Research . Vol. 1077. Selected, peer reviewed papers from the 2014 3rd International Conference on Mechanical, Engineering and Materials (ICMEM 2014), November 5-6, 2014, Singapore, (2015), s. 82-88
    solder
    článok zo zborníka
    AFC - Reports at international scientific conferences
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