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  1.  

    Topical termYoungs modulus
    Collection kindpredmetové heslá
    References (4) - článok
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    subject heading

  2.  

    Topical termarchitektúra dánska
    Collection kindpredmetové heslá
    References (1) - zborník
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    subject heading

  3.  

    Meeting nameInternational microelectronics assembly and packaging society 5. October 24-25, 2019 Brno, Czech Republic
    Collection kindakcie
    References (1) - zborník (príspevkov)
    action

    action


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