Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
Koleňák Roman ; 063700  Kostolný Igor ; 063000
AIMS Materials Science : . Vol. 5, iss. 5 (2018), online, s. 889-901
solder substrate wetting thermal properties
http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
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