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Wettability of selected lead-free solders for higher application temperatures
CREPC201606 CREPC201607 CREPC201609 CREPC102016 CREPC201611 CREPC201701 CREPC201702 CREPC201703 C Title statement Wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný, Pavol Šebo Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva Another responsib. Kostolný, Igor, 1988- Z3 (Author) - MTF Ústav výrobných technológií Šebo, Pavol (Author) Note článok publikovaný v časopise: Key Engineering Materials, ISSN 1662-9795, Vol. 705, 2016, pp. 190-195 In 2016 IACSIT Hong Kong Conferences / 2016 IACSIT Hong Kong Conferences. -- [b.m.] : IACSIT Press, 2016. -- ISSN 1662-9795. -- CD-ROM, s.[6] Subj. Headings solder substrate wetting Language English URL https://www.scopus.com/record/display.uri?eid=2-s2.0-84984602072&origin=resultslist&sort=plf-f&src=s&st1=wettability+of+selected+lead-free+solders+for+higher+application+temperatures&st2=&sid=A4D95E46B7A69AC9AF6AFDC88FD4E44A.N5T5nM1aaTEF8rE6yKCR3A%3a20&sot=b&sdt=b&sl=92&s=TITLE-ABS-KEY%28wettability+of+selected+lead-free+solders+for+higher+application+temperatures%29&relpos=0&citeCnt=0&searchTerm= Document kind RZB - článok zo zborníka Category AFC - Reports at international scientific conferences Category (from 2022) V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka Year 2016 
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