The effect of increased Cu content on microstructure and melting of utilized Sn-0.3Ag-0.7Cu solder

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Title statement	The effect of increased Cu content on microstructure and melting of utilized Sn-0.3Ag-0.7Cu solder / aut. Marián Drienovský, Lýdia Rízeková Trnková, Roman Čička, Pavol Priputen, Marcela Pekarčíková, Jozef Janovec
Main entry-name	Drienovský, Marián, 1983- (Author) - MTF Ústav materiálov
Another responsib.	Rízeková Trnková, Lýdia, 1962- Z1 (Author) - MTF Ústav materiálov
	Čička, Roman, 1974- Z1 (Author) - MTF Ústav materiálov
	Priputen, Pavol, 1976- Z2 (Author) - MTF Ústav materiálov
	Pekarčíková, Marcela, 1974- Z2 (Author) - MTF Ústav materiálov
	Janovec, Jozef, 1956- Z2 (Author) - SlovakION
In	Vedecké práce MtF STU v Bratislave so sídlom v Trnave. Research papers Faculty of Materials Science and Technology Slovak University of Technology in Trnava. -- ISSN 1336-1589. -- Vol. 26, no. 43 (2018), s. 33-44
Subj. Headings	intermetallic compound
	solidification
	thermodynamic calculations
Language	English
URL	https://www.researchpapers.mtf.stuba.sk/wp-content/uploads/2019/01/VP43_4_VP43_Drienovsk%C3%BD.pdf
Document kind	RBX - článok z periodika
Category	ADF - Scientific titles in home not carented magazines and other year-books
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Year	2018

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Number of the records: 1