Concept of PIC packaging with microwave, DC and fiber array ports

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Title statement	Concept of PIC packaging with microwave, DC and fiber array ports / aut. Jozef Chovan, Martin Tomáška, František Uherek, Daniel Haško, Dana Seyringer, Lenka Gajdošová, Eduard Koza, Jozef Pavlov
Main entry-name	Chovan, Jozef, 1974- (Author)
Another responsib.	Tomáška, Martin, 1955- Z1 (Author) - FEI Ústav elektroniky a fotoniky
	Uherek, František, 1954- Z1 (Author) - FEI Ústav elektroniky a fotoniky
	Haško, Daniel, 1975- Z5 (Author)
	Seyringer, Dana (Author)
	Gajdošová, Lenka, 1981- (Author)
	Koza, Eduard (Author)
	Pavlov, Jozef (Author)
In	FOAN 2019 / 2019 International Workshop on Fiber Optics in Access Networks (FOAN). -- Piscataway : IEEE, 2019. -- ISBN 978-1-7281-1563-4. -- ISSN 2378-8488. -- S. 38-41
Subj. Headings	integrated photonics
	photonics integrated circuits
	packaging
	information and communication technology
	concept
Language	English
URL	https://ieeexplore.ieee.org/document/8933777
Document kind	RZB - článok zo zborníka
Category	AFC - Reports at international scientific conferences
Category (from 2022)	V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka
Year	2019

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Number of the records: 1