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Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating
Title statement Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating / aut. Marián Drienovský, Marián Palcut, Pavol Priputen, Eva Cuninková, Ondrej Bošák, Marian Kubliha, Lýdia Rízeková Trnková Main entry-name Drienovský, Marián, 1983- (Author) - MTF Ústav materiálov Another responsib. Palcut, Marián, 1981- Z2 (Author) - MTF Ústav materiálov Priputen, Pavol, 1976- Z2 (Author) - MTF Ústav materiálov Cuninková, Eva, 1988 Z2 (Author) - MTF Ústav materiálov Bošák, Ondrej, 1975- Z1 (Author) - MTF Ústav materiálov Kubliha, Marian, 1971- Z1 (Author) - MTF Ústav materiálov Rízeková Trnková, Lýdia, 1962- Z1 (Author) - MTF Ústav materiálov In Advances in Materials Science and Engineering. -- ISSN 1687-8434. -- Vol. 2020, (2020), s. 1-9 Language English URL https://www.hindawi.com/journals/amse/2020/1724095/ Document kind RBX - článok z periodika Category ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu In databases CC: 000522448200003
WOS: 000522448200003
DOI: 10.1155/2020/1724095
SCOPUS: 2-s2.0-85082701008Year 2020 
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Number of the records: 1