Number of the records: 1
Active soft solder for ultrasonic soldering at higher application temperatures
Title statement Active soft solder for ultrasonic soldering at higher application temperatures : patent number: WO2020115653 (A1) - 2020-06-11, aplication number: WO2019IB60395 20191203, priority numbers: SK20180000139 20181206, SK20180000222U 20181206 / aut. Roman Koleňák, Igor Kostolný Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov Issue data Mníchov, Germany : European Patent Office, 2020 Phys.des. 4 s. Country Germany Language English URL https://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2020115653&KC=&FT=E&locale=en_EP# Document kind NPS - patentový spis Category AGJ - Authority certificates, patents, discoveries Category (from 2022) D1 - Dokument práv duševného vlastníctva Year 2020 
book
Number of the records: 1