Number of the records: 1  

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

  1. Title statementCharacterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Babincová, Peter Gogola
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov
    Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
    Drápala, Jaromír (Author)
    Babincová, Paulína 1988 Z2 (Author) - MTF Ústav materiálov
    Gogola, Peter, 1984- Z2 (Author) - MTF Ústav materiálov
    In Metals. -- ISSN 2075-4701. -- Vol. 11, iss. 4 (2021), s. 1-21
    Subj. Headings ultrasonic soldering
    active solder
    silicon
    copper
    LanguageEnglish
    URLhttps://www.mdpi.com/2075-4701/11/4/624
    Document kindRBX - článok z periodika
    CategoryADC - Scientific titles in foreign carented magazines and noticed year-books
    Category (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    Type of documentčlánok
    In databases CC: 000643281000001
    WOS: 000643281000001
    DOI: 10.3390/met11040624
    SCOPUS: 2-s2.0-85104028326
    Year2021
    article

    article

Number of the records: 1  

  This site uses cookies to make them easier to browse. Learn more about how we use cookies.