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Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper
Title statement Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Babincová, Peter Gogola Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov Drápala, Jaromír (Author) Babincová, Paulína 1988 Z2 (Author) - MTF Ústav materiálov Gogola, Peter, 1984- Z2 (Author) - MTF Ústav materiálov In Metals. -- ISSN 2075-4701. -- Vol. 11, iss. 4 (2021), s. 1-21 Subj. Headings ultrasonic soldering active solder silicon copper Language English URL https://www.mdpi.com/2075-4701/11/4/624 Document kind RBX - článok z periodika Category ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok In databases CC: 000643281000001
WOS: 000643281000001
DOI: 10.3390/met11040624
SCOPUS: 2-s2.0-85104028326Year 2021 article
Number of the records: 1