Number of the records: 1
Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound
Title statement Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound / aut. Igor Kostolný, Tomáš Meluš, Roman Koleňák, Paulína Babincová, Michal Šimek Main entry-name Kostolný, Igor, 1988- (Author) - MTF Katedra zvárania a spájania materiálov Another responsib. Meluš, Tomáš, 1995- Z3 (Author) - MTF Ústav výrobných technológií Koleňák, Roman, 1973- Z1 (Author) - MTF Katedra zvárania a spájania materiálov Babincová, Paulína 1988 Z2 (Author) - MTF Ústav materiálov Šimek, Michal (Author) Note A- In International Review of Mechanical Engineering. -- ISSN 1970-8734. -- Vol. 15, iss. 6 (2021), s. 287-293 Subj. Headings active solder microstructure soldering laser beam ultrasonic ceramics Language English URL https://www.praiseworthyprize.org/jsm/index.php?journal=ireme&page=article&op=view&path%5B%5D=25975 Document kind RBX - článok z periodika Category ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok In databases DOI: 10.15866/ireme.v15i6.21048
SCOPUS: 2-s2.0-85117272074Year 2021 
article
Number of the records: 1