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Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Title statement	Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Ján Urminský, Alexej Pluhár, Paulína Babincová, Daniel Drimal
Main entry-name	Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov
Another responsib.	Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
	Drápala, Jaromír (Author)
	Urminský, Ján, 1989- Z1 (Author) - MTF Katedra zvárania a spájania materiálov
	Pluhár, Alexej, 1995- Z3 (Author) - MTF Ústav výrobných technológií
	Babincová, Paulína 1988 Z2 (Author) - MTF Ústav materiálov
	Drimal, Daniel (Author)
Note	A+
In	Materials. -- ISSN 1996-1944. -- Vol. 15, iss. 15 (2022), s. 1-21
Subj. Headings	active solder
	solderability
	wettability
	electron beam
	SiC ceramics
Language	English
URL	https://www.mdpi.com/1996-1944/15/15/5301
Document kind	RBX - článok z periodika
Category	ADC - Scientific titles in foreign carented magazines and noticed year-books
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
In databases	CC: 000840225200001 WOS: 000840225200001 DOI: 10.3390/ma15155301 SCOPUS: 2-s2.0-85137145451
Year	2022

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Number of the records: 1