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Fundamentals of Lead-Free Solder Interconnect Technology
Title statement Fundamentals of Lead-Free Solder Interconnect Technology : from Microstructures to Reliability / aut. Tae-Kyu Lee, et al Main entry-name Lee, Tae-Kyu (Author) Another responsib. et al. Issue data New York Springer 2015 Phys.des. 253 s. ISBN 978-1-4614-9265-8 Subj. Headings bezolovnaté spájkovanie Country United States Language English Document kind AMG - monografia 
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Barcode Call number of location Call number Location Sublocation Info 284M089182 M* 14671-1 Materiálovotechnická fakulta M KN borrowed (until *12.02.2025)
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