Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates

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Title statement	Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates / aut. Roman Koleňák, Tomáš Meluš, Jaromír Drápala, Peter Gogola, Matej Pašák
Main entry-name	Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov
Another responsib.	Meluš, Tomáš, 1995- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
	Drápala, Jaromír (Author)
	Gogola, Peter, 1984- Z2 (Author) - MTF Ústav materiálov
	Pašák, Matej, 1985- Z1 (Author) - MTF Ústav materiálov
In	Materials. -- ISSN 1996-1944. -- Vol. 18, iss. 5 (2025), art. no. 1094, s. 1-18
Subj. Headings	soldering
	Al2O3 ceramic
	Cu substrate
	Zn solder
	ultrasonic soldering
Language	English
URL	https://www.mdpi.com/1996-1944/18/5/1094
Document kind	RBX - článok z periodika
Category	ADC - Scientific titles in foreign carented magazines and noticed year-books
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
In databases
Year	2025

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Number of the records: 1