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Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

  1. Title statementProceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : Como, Italy, 21.-26.4.2006
    Issue data2006
    Document kindBRZ - zborník (príspevkov)
    References (1) - článok
    book

    book


Number of the records: 1  

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