Bezolovnaté spájky pre elektrotechnický priemysel

Number of the records: 1

Title statement	Bezolovnaté spájky pre elektrotechnický priemysel
Main entry-name	Rízeková Trnková, Lýdia Z1 (Author) - MTF Ústav materiálov
Another responsib.	, (Thesis advisor)
Translated title	Lead-freee solders for electronics industry
Issue data	2018
Faculty	MTF
Date of acceptation	13.12.2018
Degreee discipline	strojárske technológie a materiály
Degree program	null
Phys.des.	72 s.
Subj. Headings	zliatiny Sn Ag-Cu
	bezolovnaté spájky
	mikroštruktúra
	lead-free solders
	Sn-Ag-Cu alloys
	microstructure
Language	Slovak
URL	http://is.stuba.sk/zp/portal_zp.pl?podrobnosti_zp=70696
Document kind	DHP - habilitačná práca
Category	DAI - Qualificational works (thesis, habilitation, atestation...)
Year	2019

book

Barcode	Call number of location	Call number	Location	Sublocation	Info
.		M* HP-133	Materiálovotechnická fakulta	M štud. kvalif. prác	unavailable

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Number of the records: 1