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Research of soldering silicon substrate with solder type Sn-Ag-Ti
CREPC201502 CREPC201506_01 CREPCXX CREPC201511 CREPC201601 CREPC201602 CREPC201603 CREPC201606 CR Title statement Research of soldering silicon substrate with solder type Sn-Ag-Ti / aut. Roman Koleňák, Michal Prach Main entry-name Koleňák, Roman, 1973- (Author) - MTF Ústav výrobných technológií Another responsib. Prach, Michal, 1988- Z3 (Author) - MTF Ústav výrobných technológií In Applied Mechanics and Materials / International Conference on Chemical, Mechanical and Materials Engineering.. -- ISSN 1660-9336. -- Vol. 729. Selected, peer reviewed papers from the 2014 3rd International Conference on Chemical, Mechanical and Materials Engineering (CMME 2014), October 24-25, 2014, Riga, Latvia, (2015), s. 32-38 Subj. Headings active solder shear strength Language English Document kind RZB - článok zo zborníka Category AFC - Reports at international scientific conferences Category (from 2022) V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka Year 2015 
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