Number of the records: 1
Research of soldering silicon substrate with solder type Sn-Ag-Ti
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$7 stu_us_auth*stu42582 $a Koleňák, Roman, $d 1973- $u M3000 $r Z1 $4 aut $9 50 $U MTF Materiálovotechnologická fakulta $T MTF Ústav výrobných technológií $X 2767 $U M3000 $Y 83 245 10
$a Research of soldering silicon substrate with solder type Sn-Ag-Ti / $c aut. Roman Koleňák, Michal Prach 650 04
$7 stu_us_auth*stus43443 $a active solder 650 04
$7 stu_us_auth*stus22862 $a shear strength 700 1-
$7 stu_us_auth*stu101771 $a Prach, Michal, $d 1988- $u M3000 $r Z3 $4 aut $9 50 $U MTF Materiálovotechnologická fakulta $T MTF Ústav výrobných technológií $X 48639 $U M3000 $Y 83 773 0-
$w stu_us_cat*0001432 $t Applied Mechanics and Materials $x 1660-9336 $7 m2as $a International Conference on Chemical, Mechanical and Materials Engineering. $g Vol. 729. Selected, peer reviewed papers from the 2014 3rd International Conference on Chemical, Mechanical and Materials Engineering (CMME 2014), October 24-25, 2014, Riga, Latvia, (2015), s. 32-38
Number of the records: 1