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Effect of in addition to Zn-5Al solder on microstructure and properties of solder joints
CREPC201709 CREPC201710 CREPC201711 CREPC022018 CREPC201802 CREPC201803 CREPC201806 Title statement Effect of in addition to Zn-5Al solder on microstructure and properties of solder joints / aut. Igor Kostolný, Roman Koleňák Main entry-name Kostolný, Igor, 1988- (Author) - MTF Ústav výrobných technológií Another responsib. Koleňák, Roman, 1973- Z1 (Author) - MTF Katedra zvárania a zlievarenstva In Key Engineering Materials / International Conference on Material Science and Engineering. -- ISSN 1013-9826. -- Vol. 723: Selected, peer reviewed papers from the International Conference on Material Science and Engineering (ICMSE 2016), June 24-26, 2016, Guangzhou, China, (2017), s. 357-362 Subj. Headings solder flux free soldering joints Language English Document kind RZB - článok zo zborníka Category AFC - Reports at international scientific conferences Category (from 2022) V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka Year 2017 References (1) - článok 
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