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Lead-Free Soldering in Microelectronics
CREPC201709 CREPC201710 CREPC201711 CREPC022018 CREPC201802 CREPC201803 CREPC201806 Title statement Lead-Free Soldering in Microelectronics / aut. Erika Hodúlová ; rec. Huaping Xiong, Ján Viňás, Warren Miglietti Main entry-name Hodúlová, Erika, 1978- (Author) - MTF Ústav výrobných technológií Another responsib. Xiong, Huaping (Reviewer) Viňás, Ján (Reviewer) Miglietti, Warren (Reviewer) Edition statement 1. vyd. Issue data Plzeň : Vydavatelství a nakladatelství Aleš Čeněk, 2017 Phys.des. 92 s. ISBN 978-80-7380-615-6 Subj. Headings Mikroelektronika Microelectronics lead-free solder Country Czech Republic Language English Copy count 100, currently available 100 Document kind AMG - monografia Category AAA - Scientific monography issued in foreign editorships Category (from 2022) V1 - Vedecký výstup publikačnej činnosti ako celok Year 2017 
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Number of the records: 1