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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

  1. Title statementInvestigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
    Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva
    Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií
    In AIMS Materials Science. -- ISSN 2372-0484. -- Vol. 5, iss. 5 (2018), online, s. 889-901
    Subj. Headings solder
    substrate
    wetting
    thermal properties
    LanguageEnglish
    Document kindRBX - článok z periodika
    CategoryADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    Year2018
    Ohlasy[1] CURTULO, Joanisa P. - DIAS, Marcelino - BERTELLI, Felipe - SILVA, Bismarck L. - SPINELLI, José E. - GARCIA, Amauri - CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. In Journal of Manufacturing Processes, 2019, 48, pp. 164-173. ISSN 15266125. SCOPUS ; WOS ; CC
    [1] WEBER, Felix - RETTENMAYR, Markus. Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders. In Journal of Materials Science, 2021, 56, 4, pp. 3444-3454. ISSN 00222461. SCOPUS ; WOS ; CC
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Number of the records: 1