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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
Title statement Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný Main entry-name Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a zlievarenstva Another responsib. Kostolný, Igor, 1988- Z2 (Author) - MTF Ústav výrobných technológií In AIMS Materials Science. -- ISSN 2372-0484. -- Vol. 5, iss. 5 (2018), online, s. 889-901 Subj. Headings solder substrate wetting thermal properties Language English Document kind RBX - článok z periodika Category ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Year 2018 Citations [1] 2019: CURTULO, Joanisa P. - DIAS, Marcelino - BERTELLI, Felipe - SILVA, Bismarck L. - SPINELLI, José E. - GARCIA, Amauri - CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. In Journal of Manufacturing Processes, 2019, 48, pp. 164-173. ISSN 15266125. [1] 2021: WEBER, Felix - RETTENMAYR, Markus. Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders. In Journal of Materials Science, 2021, 56, 4, pp. 3444-3454. ISSN 00222461. [1] 2021: ADETUNJI, Olayide R. - ASHIMOLOWO, Ridwan A. - AIYEDUN, Peter O. - ADESUSI, Olanrewaju M. - ADEYEMI, Hezekiah O. - OLOYEDE, Olamilekan R. Tensile, hardness and microstructural properties of Sn-Pb solder alloys. In Materials Today: Proceedings, 2021, 44, pp. 321-325. 
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