Title information : Direct bonding of silicon with solders type Sn-Ag-Ti / aut. Roman Koleňák, Igor Kostolný, Martin Sahul Variant heading : \q12*stu_us_auth*1 stu42582 \q \q1013 stu_us_auth*stu42582 \d Koleňák Roman \q ; 063700  %continue : \q12*stu_us_auth*1 stu95921 \q \q1013 stu_us_auth*stu95921 \d Kostolný Igor \q ; 063000 \q12*stu_us_auth*1 stu81560 \q \q1013 stu_us_auth*stu81560 \d Sahul Martin \q ; 061000 In : \q12**1 0015940 \q %continue : Soldering and Surface Mount Technology %continue : . Vol. 28, Iss. 3 (2016), s. 149-158 Subject : \q12*stu_us_auth*1 stus22862 \q \q1013 stu_us_auth*stus22862 \d shear strength \q \q12*stu_us_auth*1 stus27375 \q \q1013 stu_us_auth*stus27375 \d silicon \q \q12*stu_us_auth*1 stus21866 \q \q1013 stu_us_auth*stus21866 \d soldering \q URL : http://dx.doi.org/10.1108/SSMT-11-2015-0040 Document kind : článok z periodika Category : ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) : V3 - Vedecký výstup publikačnej činnosti z časopisu