1. Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
Title information : Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
Variant heading : \q12*stu_us_auth*1 stu42582 \q \q1013 stu_us_auth*stu42582 \d Koleňák Roman \q ; 063700
%continue : \q12*stu_us_auth*1 stu95921 \q \q1013 stu_us_auth*stu95921 \d Kostolný Igor \q ; 063000
In : \q12**1 0067011 \q
%continue : AIMS Materials Science :
%continue : . Vol. 5, iss. 5 (2018), online, s. 889-901
Subject : \q12*stu_us_auth*1 stus44261 \q \q1013 stu_us_auth*stus44261 \d solder \q \q12*stu_us_auth*1 stus44863 \q \q1013 stu_us_auth*stus44863 \d substrate \q \q12*stu_us_auth*1 stus41140 \q \q1013 stu_us_auth*stus41140 \d wetting \q \q12*stu_us_auth*1 stus31906 \q \q1013 stu_us_auth*stus31906 \d thermal properties \q
URL : http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
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