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  1. Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Babincová, Peter Gogola
    Koleňák Roman ; 063100  Kostolný Igor ; 063100 Drápala Jaromír Babincová Paulína ; 061000 Gogola Peter ; 061000
    Metals . Vol. 11, iss. 4 (2021), s. 1-21
    ultrasonic soldering active solder silicon copper
    https://www.mdpi.com/2075-4701/11/4/624
    článok z periodika
    ADC - Scientific titles in foreign carented magazines and noticed year-books
    V3 - Vedecký výstup publikačnej činnosti z časopisu
    article

    article

  2. Research of the new soldering alloys based on Sn-Sr and Sn-Ag-Sr / aut. Roman Koleňák, Alexej Pluhár, Igor Kostolný, Jaromír Drápala
    Koleňák Roman ; 063100  Pluhár Alexej ; 063000 Kostolný Igor ; 063100 Drápala Jaromír
    International Journal of Engineering Trends and Technology (IJETT) . Vol. 69, iss. 10 (2021), s. 46-51
    active solder microstructure soldering intermetallic phases EDX analysis
    https://ijettjournal.org/archive/ijett-v69i10p207
    článok z periodika
    ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    V3 - Vedecký výstup publikačnej činnosti z časopisu
    article

    article

  3. Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound / aut. Igor Kostolný, Tomáš Meluš, Roman Koleňák, Paulína Babincová, Michal Šimek
    Kostolný Igor ; 063100  Meluš Tomáš ; 063000 Koleňák Roman ; 063100 Babincová Paulína ; 061000 Šimek Michal
    International Review of Mechanical Engineering . Vol. 15, iss. 6 (2021), s. 287-293
    active solder microstructure soldering laser beam ultrasonic ceramics
    https://www.praiseworthyprize.org/jsm/index.php?journal=ireme&page=article&op=view&path%5B%5D=25975
    článok z periodika
    ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    V3 - Vedecký výstup publikačnej činnosti z časopisu
    article

    article

  4. Soldering by the Active Lead-Free Tin and Bismuth-Based Solders / aut. Roman Koleňák, Martin Provazník, Igor Kostolný
    Koleňák Roman ; 063100  Provazník Martin Kostolný Igor ; 063100
    Lead Free Solders . S.1-21
    active solder ceramics metals ultrasonic soldering shear strength
    https://www.intechopen.com/books/lead-free-solders/soldering-by-the-active-lead-free-tin-and-bismuth-based-solders
    článok zo zborníka
    AEC - Scientific titles in foreign noticed scientific year-books (not conference)
    V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka
    article

    article

  5. Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound / aut. Roman Koleňák
    Koleňák Roman ; 063700 
    Recent Progress in Soldering Materials . online, s. 63-90
    solder active solder metallic materials
    https://www.intechopen.com/books/recent-progress-in-soldering-materials/recent-advances-in-solderability-of-ceramic-and-metallic-materials-with-application-of-active-solder
    kapitola(článok) z dokumentu
    AEC - Scientific titles in foreign noticed scientific year-books (not conference)
    V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníka
    article

    article

  6. Research of soldering silicon substrate with solder type Sn-Ag-Ti / aut. Roman Koleňák, Michal Prach
    Koleňák Roman ; M3000  Prach Michal ; M3000
    Applied Mechanics and Materials . Vol. 729. Selected, peer reviewed papers from the 2014 3rd International Conference on Chemical, Mechanical and Materials Engineering (CMME 2014), October 24-25, 2014, Riga, Latvia, (2015), s. 32-38
    active solder shear strength
    článok zo zborníka
    AFC - Reports at international scientific conferences
    article

    article

  7. Determination of Mechanical Properties of Active Solder Alloys using the Measuring Method "Small Punch Test"
    Koleňák Roman ; M3000  Martinkovič Maroš ; M3000
    Key Engineering Materials : . s. 174-177
    active solder mechanical properties
    článok zo zborníka
    AFD - Reports at home scientific conferences
    article

    article

  8. Research of Joining Graphite by use of Active Solder
    Koleňák Roman ; M3000  Prach Michal ; M3000
    Advanced Materials Research : . s.1270-1274
    active solder wettability graphite
    článok zo zborníka
    article

    article

  9. Joining Active Metals with Al2O3 by Use of Solders
    Koleňák Roman ; M3000  Prach Michal ; M3000
    Advanced Materials Research : . Vol. 664 (2013), s.667-671
    active solder active metals
    článok z periodika
    AFC - Reports at international scientific conferences
    article

    article

  10. Research of joining SiO2 ceramic material by use of active solder
    Koleňák Roman ; M3000  Chachula Michal ; M3000
    Advanced Science Letters . Vol. 19, No. 2 (2013), s.[5] p.
    active solder wettability
    článok z periodika
    ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
    V3 - Vedecký výstup publikačnej činnosti z časopisu
    article

    article