Search results
- Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging / aut. X Liu, H Xu, H Li, Erika Hodúlová, Ingrid Kovaříková
Liu X. Xu H. Li H. Xu J. Hodúlová Erika ; 063100 Kovaříková Ingrid ; 063100
Materials Review . Vol. 35, iss. 19 (2021), s. 116-124
High-temperature packaging Power chip solder Structural Reliability Transient liquid phase bonding
http://www.mater-rep.com/EN/lexeme/showArticleByLexeme.do?articleID=4256
článok z periodika
ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
V3 - Vedecký výstup publikačnej činnosti z časopisu
article
- Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Babincová, Matej Pašák
Koleňák Roman ; 063100 Kostolný Igor ; 063100 Drápala Jaromír Babincová Paulína ; 061000 Pašák Matej ; 061000
Materials [elektronický zdroj] . Vol. 14, iss. 21 (2021), s.1-22
ultrasonic intermetallic compounds solder composite
https://www.mdpi.com/1996-1944/14/21/6369
článok z periodika
ADC - Scientific titles in foreign carented magazines and noticed year-books
V3 - Vedecký výstup publikačnej činnosti z časopisuarticle
- Application of a ternary ZN-based solder alloy for joining of AZ31B magnesium alloy with ultrasonic support / aut. Miroslav Jáňa, Igor Kostolný
Jáňa Miroslav Kostolný Igor ; 063100
Zváranie - Svařování : . Roč. 68, č. 1 (2019), s. 27-29
metallurgical joining solder Mg alloys intermetallic phases
článok z periodika
BDF - Scientific works in others home magazines
O3 - Odborný výstup publikačnej činnosti z časopisuarticle
- Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Sahul, Ján Urminský
Koleňák Roman ; 063700 Kostolný Igor ; 063000 Drápala Jaromír Sahul Martin ; 061000 Urminský Ján ; 063000
Metals . Vol. 8, iss. 4 (2018), s.274-274
solder ceramics Copper
http://www.mdpi.com/2075-4701/8/4/274
http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=C5gAsJpoWyyGa5AfUVj&page=1&doc=1
článok z periodika
ADC - Scientific titles in foreign carented magazines and noticed year-books
V3 - Vedecký výstup publikačnej činnosti z časopisuarticle
- Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
Koleňák Roman ; 063700 Kostolný Igor ; 063000
AIMS Materials Science : . Vol. 5, iss. 5 (2018), online, s. 889-901
solder substrate wetting thermal properties
http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm=
článok z periodika
ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
V3 - Vedecký výstup publikačnej činnosti z časopisuarticle
- Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper / aut. Roman Koleňák, Igor Kostolný, Martin Kusý
Koleňák Roman ; 063700 Kostolný Igor ; 063000 Kusý Martin ; 061000
Materials Science and Engineering A. Structural Materials. Properties, Microstructure and Processing . Vol. 712, 17 January (2018), s. 302-312
solder ultrasonic soldering
https://www.sciencedirect.com/science/article/pii/S0921509317315812
https://www.scopus.com/record/display.uri?eid=2-s2.0-85036474137&origin=resultslist&sort=plf-f&src=s&st1=Characterization+of+soldering+alloy+type+Zn-In-Mg+and+the+study+of+direct+soldering+of+silicon+and+copper&st2=&sid=9d773a1a87bb201fdf08bef518dd8d7a&sot=b&sdt=b&sl=120&s=TITLE-ABS-KEY%28Characterization+of+soldering+alloy+type+Zn-In-Mg+and+the+study+of+direct+soldering+of+silicon+and+copper%29&relpos=0&citeCnt=0&searchTerm=
http://apps.webofknowledge.com/full_record.do?product=CCC&search_mode=GeneralSearch&qid=1&SID=D1UsnRmIMLGvmytySF8&page=1&doc=1
článok z periodika
ADC - Scientific titles in foreign carented magazines and noticed year-books
V3 - Vedecký výstup publikačnej činnosti z časopisuarticle
- Effect of in addition on microstructure and properties of Zn-5Al solder / aut. Roman Koleňák, Igor Kostolný
Koleňák Roman ; 063700 Kostolný Igor ; 063000
Key Engineering Materials . Vol. 737. Selected, peer reviewed papers from the 2016 International Conference on Material Science and Engineering Technology (ICMSET 2016), October 14-16, 2016, Phuket, Thailand, (2017), s. 107-113
solder microstructure strength
článok zo zborníka
AFC - Reports at international scientific conferences
V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníkaarticle
- Effect of in addition to Zn-5Al solder on microstructure and properties of solder joints / aut. Igor Kostolný, Roman Koleňák
Kostolný Igor ; 063000 Koleňák Roman ; 063700
Key Engineering Materials . Vol. 723: Selected, peer reviewed papers from the International Conference on Material Science and Engineering (ICMSE 2016), June 24-26, 2016, Guangzhou, China, (2017), s. 357-362
solder flux free soldering joints
https://www.scopus.com/record/display.uri?eid=2-s2.0-85009110535&origin=resultslist&sort=plf-f&src=s&st1=Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints&st2=&sid=E230406AC6FFBDD2A1ED32FA12A49A1F.wsnAw8kcdt7IPYLO0V48gA%3a10&sot=b&sdt=b&sl=103&s=TITLE-ABS-KEY%28Effect+of+in+addition+to+Zn-5Al+solder+on+microstructure+and+properties+of+solder+joints%29&relpos=0&citeCnt=0&searchTerm=
článok zo zborníka
AFC - Reports at international scientific conferences
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(1) - článokarticle
- Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound / aut. Roman Koleňák
Koleňák Roman ; 063700
Recent Progress in Soldering Materials . online, s. 63-90
solder active solder metallic materials
https://www.intechopen.com/books/recent-progress-in-soldering-materials/recent-advances-in-solderability-of-ceramic-and-metallic-materials-with-application-of-active-solder
kapitola(článok) z dokumentu
AEC - Scientific titles in foreign noticed scientific year-books (not conference)
V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníkaarticle
- Wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný, Pavol Šebo
Koleňák Roman ; 063700 Kostolný Igor ; 063000 Šebo Pavol
2016 IACSIT Hong Kong Conferences . CD-ROM, s.[6]
solder substrate wetting
https://www.scopus.com/record/display.uri?eid=2-s2.0-84984602072&origin=resultslist&sort=plf-f&src=s&st1=wettability+of+selected+lead-free+solders+for+higher+application+temperatures&st2=&sid=A4D95E46B7A69AC9AF6AFDC88FD4E44A.N5T5nM1aaTEF8rE6yKCR3A%3a20&sot=b&sdt=b&sl=92&s=TITLE-ABS-KEY%28wettability+of+selected+lead-free+solders+for+higher+application+temperatures%29&relpos=0&citeCnt=0&searchTerm=
článok zo zborníka
AFC - Reports at international scientific conferences
V2 - Vedecký výstup publikačnej činnosti ako časť editovanej knihy alebo zborníkaarticle