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  1. Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures / aut. Roman Koleňák, Igor Kostolný
    Koleňák Roman ; 063700  Kostolný Igor ; 063000
    AIMS Materials Science : . Vol. 5, iss. 5 (2018), online, s. 889-901
    solder substrate wetting thermal properties
    http://www.aimspress.com/article/10.3934/matersci.2018.5.889/pdf
    https://www.scopus.com/record/display.uri?eid=2-s2.0-85055565532&origin=resultslist&sort=plf-f&src=s&st1=Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+&st2=&sid=063fe61641a5efb30bc8d0290322e6c2&sot=b&sdt=b&sl=116&s=TITLE-ABS-KEY%28Investigation+of+microstructure+and+wettability+of+selected+lead-free+solders+for+higher+application+%29&relpos=0&citeCnt=0&searchTerm=
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