Počet záznamov: 1

International microelectronics assembly and packaging society 2018

SYS		0035176
LBL		00000nz--a22^^^^^n--4500
003		SK-STU
005		20181116163715.8
008		181116\|n\|acnnnaabn-----------n-ana-----d
040		$a STU $b slo
111	2-	$a International microelectronics assembly and packaging society 2018 $n 4. $d October 25-26, 2018 $c Brno, Czech Republic

Počet záznamov: 1