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Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper
Údaje o názve Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper / aut. Roman Koleňák, Igor Kostolný, Martin Kusý Záhlavie-meno Koleňák, Roman, 1973- (Autor) - MTF Katedra zvárania a zlievarenstva Ďal.zodpovednosť Kostolný, Igor, 1988- Z2 (Autor) - MTF Ústav výrobných technológií Kusý, Martin, 1975- Z1 (Autor) - MTF Ústav materiálov Poznámky IF 2017: 3,414 In Materials Science and Engineering A. Structural Materials. Properties, Microstructure and Processing. -- ISSN 0921-5093. -- Vol. 712, 17 January (2018), s. 302-312 Predmet.heslá solder ultrasonic soldering Jazyk dok. angličtina Druh dok. RBX - článok z periodika Kategória ADC - Vedecké práce v zahraničných karentovaných časopisoch Kategória od 2022 V3 - Vedecký výstup publikačnej činnosti z časopisu Rok 2018 Ohlasy [1] 2019: TUNCKAN, Orkun - YURDAKUL, Hilmi - TURAN, Servet. Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy. In Journal of Advanced Ceramics, 2019, 8, 4, pp. 500-508. ISSN 22264108. [1] 2020: HE, Siliang - GAO, Runhua - SHEN, Yu-An - LI, Jiahui - NISHIKAWA, Hiroshi. Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere. In JOURNAL OF MATERIALS SCIENCE, 2020, vol. 55, no. 7, pp. 3107-3117. ISSN 0022-2461. [1] 2021: WEBER, Felix - RETTENMAYR, Markus. Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders. In Journal of Materials Science, 2021, 56, 4, pp. 3444-3454. ISSN 00222461. 2022: WANG, Wenjing - DENG, Yong - CHEN, Xiumin - WANG, Xuquan - ZHAO, Zhongqian - HE, Bingyang - WANG, Hongyu - LI, Wei - XU, Peilin - YIN, Qi. Density functional theory study of Zninfn/infIninfn/inf (n = 2–10) alloy clusters. In Journal of Molecular Structure, 2022-01-05, 1247, pp. ISSN 00222860. 2022: XU, Zhiwu - LI, Zhengwei - XU, Zirong - MA, Zhongwei - CHEN, Shu - LIU, Xuesong - YAN, Jiuchun. Avoiding degradation and increasing joint strength of Al alloys by rapid ultrasonic soldering at low temperature. In Journal of Materials Processing Technology, 2022-02-01, 300, pp. ISSN 09240136. 2022: YAN, Han - LI, Zhengwei - XU, Zhiwu - REN, Boxu. Low temperature bonding mechanism of porous Siinf3/infNinf4/inf ceramics by Sn9Zn solder in ultrasonic-assisted soldering. In Materials Characterization, 2022-03-01, 185, pp. ISSN 10445803. 2022: CHEN, Shu - XU, Zhiwu - LI, Zhengwei - MA, Zhongwei - ZHANG, Mukun - LU, Yuansong - YAN, Jiuchun. Ultrasonic-assisted wetting and soldering of AlN ceramic by using a nonactive solder (Sn9Zn) in air. In Ceramics International, 2022-01-15, 48, 2, pp. 1898-1907. ISSN 02728842. 2022: ZHANG, Mingxuan - MA, Zhipeng - CHEN, Guijuan - XIA, Fafeng - YU, Xinlong. Spreading behavior of molten solder with alternative currents under the action of electromagnetic ultrasound. In JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, vol. 18, no., pp. 3700-3715. ISSN 2238-7854. 2022: DING, Zhijie - XUE, Haitao - GUO, Weibing - CHEN, Cuixin - JIA, Yang. Microstructure and shear strength on ultrasonic-assisted soldered the Si/Cu joint using Sn-3.5Ag solder. In: Materials Today Communications, 2022-12-01, 33, pp. 2022: LI, Haijun - LI, Yuxiang - CHEN, Chao. Microstructure and formation mechanism of Alinf2/infOinf3/inf/Zn5Al/2024Al joint by ultrasonic assisted soldering process. In: Journal of Manufacturing Processes, 2022-11-01, 83, pp. 313-324. ISSN 15266125. 2023: LI, Wenzhao - DING, Zhijie - XUE, Haitao - GUO, Weibing - CHEN, Cuixin - JIA, Yang - WAN, Zheng. Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder. In: Materials Characterization, 2023-05-01, 199, pp. ISSN 10445803. 
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