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Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper

  1. Údaje o názveCharacterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper / aut. Roman Koleňák, Igor Kostolný, Martin Kusý
    Záhlavie-meno Koleňák, Roman, 1973- (Autor) - MTF Katedra zvárania a zlievarenstva
    Ďal.zodpovednosť Kostolný, Igor, 1988- Z2 (Autor) - MTF Ústav výrobných technológií
    Kusý, Martin, 1975- Z1 (Autor) - MTF Ústav materiálov
    PoznámkyIF 2017: 3,414
    In Materials Science and Engineering A. Structural Materials. Properties, Microstructure and Processing. -- ISSN 0921-5093. -- Vol. 712, 17 January (2018), s. 302-312
    Predmet.heslá solder
    ultrasonic soldering
    Jazyk dok.angličtina
    Druh dok.RBX - článok z periodika
    KategóriaADC - Vedecké práce v zahraničných karentovaných časopisoch
    Rok2018
    Ohlasy[1] TUNCKAN, Orkun - YURDAKUL, Hilmi - TURAN, Servet. Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy. In Journal of Advanced Ceramics, 2019, 8, 4, pp. 500-508. ISSN 22264108. SCOPUS ; WOS ; CC
    [1] HE, Siliang - GAO, Runhua - SHEN, Yu-An - LI, Jiahui - NISHIKAWA, Hiroshi. Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere. In JOURNAL OF MATERIALS SCIENCE, 2020, vol. 55, no. 7, pp. 3107-3117. ISSN 0022-2461. WOS ; CC ; SCOPUS
    [1] WEBER, Felix - RETTENMAYR, Markus. Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders. In Journal of Materials Science, 2021, 56, 4, pp. 3444-3454. ISSN 00222461. SCOPUS ; WOS ; CC
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