Influence of cerium addition on microstructure and properties of Sn-Cu-(Ag) solder alloys / aut. Marián Drienovský, Lýdia Rízeková Trnková, Maroš Martinkovič, Milan Ožvold, Ivona Černičková, Marián Palcut, Jozef Janovec
Drienovský Marián ; M1000  Rízeková Trnková Lýdia ; M1000 Martinkovič Maroš ; M130 Ožvold Milan ; M1000 Černičková Ivona ; 060130 Palcut Marián ; M1000 Janovec Jozef ; M1000
Materials Science and Engineering A. Structural Materials. Properties, Microstructure and Processing . Vol. 623, (2015), s. 83-91
lead-free solders
http://ac.els-cdn.com/S0921509314014014/1-s2.0-S0921509314014014-main.pdf?_tid=8db1bb22-60fa-11e5-aa89-00000aab0f01&acdnat=1442906674_48be3691304f0b54730b0147ca6f46de
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