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Records found: 6  
Your query: Author Sysno = "^stu_us_auth stus669^"
  1. Development of a thin film packaging process of organic solar cells by thermal evaporation of oxides
    Kubiš Peter ; E  Jakabovič Ján (Thesis advisor) ; E030
    Bratislava : STU v Bratislave FEI, 2010 . - 69 s
    púzdrenie Mikroelektronika
    http://is.stuba.sk/zp/portal_zp.pl?podrobnosti=50803
    diplomová práca
    book

    book

  2. SMT. Technologie povrchové montáže
    Abel Martin 
    Pardubice : Platan, 2000 . - 246 s
    ISBN 80-902433-1-9
    púzdrenie plošné spoje spájkovanie povrchová montáž SMT SMD
    monografia
    Faculty Available Inaccesible Issued For Request Only
    FEI1002
    book

    book

  3. Faculty Available Inaccesible Issued For Request Only
    FEI0001
    book

    book

  4. Electronic packaging, microelectronics, and interconnection dictionary / [aut.] Harper,Charles A.; Miller,Martin B
    Harper Charles A  Miller Martin B
    New York : McGraw-Hill, 1993 . - 235 s
    ISBN 0-07-026688-3
    Mikroelektronika elektronické obvody integrované obvody púzdrenie
    slovník vecný
    Faculty Available Inaccesible Issued For Request Only
    FEI0100
    book

    book

  5. Advanced packaging: Key technology for the 1990s = Moderné púzdrenie: Kľúčová technológia pre 90-te roky / [aut.] Herrell,Dennis
    Herrell Dennis 
    Stanford : University Video Communications, 1991 . - 1 videokaz. ; (56 : 15);VHS PAL
    Mikroelektronika integrované obvody čipy púzdrenie multičipy
    video - kazeta
    video

    video

  6. Packaging : Handbook
    [1.vyd.]
    Santa Clara : Intel Corporation, 1991 . - Preruš.str
    ISBN 1-55512-128-4
    polovodičové súčiastky púzdrenie
    firemná literatúra
    book

    book